Kohesi Bond KB 10473 FLAO is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a convenient 1:1 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable flexibility and peel strength.
Specifications not yet published for this part. Request them from KOHESI BOND.
| Price | not published — ask the supplier |
| Lead time | not published — ask the supplier |
| Minimum order | not published — ask the supplier |
| Customisation | not published — ask the supplier |
4 of 4 commercial details are missing. Suppliers publish specifications but almost never publish price or lead time — we request these directly and add them as they arrive.
CE marking — Often self-declared. Treat as a market-access marking, not an independent quality assessment. more
ISO 13485 — Not aerospace, but indicates the supplier is used to regulated manufacture, traceability and design control. more
ISO 9001 — A floor, not a qualification. It says the company follows its own written process — it says nothing about whether that process is good enough for flight hardware. For space work, look for AS9100D on top of it. more
★ marks standards that matter specifically for flight hardware. Company-level claims, as published by the supplier and unverified — not necessarily specific to this part.
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