Kohesi Bond KB 1452 HT-2AO is an exclusive two component epoxy system suitable for bonding, sealing, coating, potting and encapsulation applications. It has a favorable 100:40 (Part A: Part B) mix ratio by weight. Remarkably, it offers excellent thermal conductivity and an extremely low coefficient of thermal expansion (CTE). The optimal cure schedule is an overnight room temperature set-up follow
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| Price | not published — ask the supplier |
| Lead time | not published — ask the supplier |
| Minimum order | not published — ask the supplier |
| Customisation | not published — ask the supplier |
4 of 4 commercial details are missing. Suppliers publish specifications but almost never publish price or lead time — we request these directly and add them as they arrive.
CE marking — Often self-declared. Treat as a market-access marking, not an independent quality assessment. more
ISO 13485 — Not aerospace, but indicates the supplier is used to regulated manufacture, traceability and design control. more
ISO 9001 — A floor, not a qualification. It says the company follows its own written process — it says nothing about whether that process is good enough for flight hardware. For space work, look for AS9100D on top of it. more
★ marks standards that matter specifically for flight hardware. Company-level claims, as published by the supplier and unverified — not necessarily specific to this part.
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